Reference Materials
Read more about Our Microelectronics Packaging Products
VERTEC® Bumped Die Carrier Film (GP-BMP3E)
Preliminary Product Datasheet – Gel-Pak’s ideal solution for bumped die, flip chip and BGA handling.
Wafer Cassette Selection
An Essential Guide for Semiconductor Users.
Bare Die Tray Catalog
Entegris Bare Die, Chip Scale and Wafer Scale Package Handling.
Graphene Dry Transfer (White Paper)
Gel-Pak’s PF film can be used in the micromechanical exfoliation & transfer of graphene.
198/192 Series 200 mm Wafer Transport Carriers
Entegris 198/192 series 200 mm wafer transport carriers address automation, contamination control, and productivity requirements for today’s 200 mm fabs.