Vacuum Release Tray

We supply Gel-Pak Vacuum Release Trays – VR Series in wide variety of specifications and configurations to suit your needs.

Gel-Pak’s patented VR Series provides a break-through in the handling of devices from small transistors and diodes to large IC’s and wafers. The surface of the tray features a proprietary membrane that holds the device in place.

A vacuum drawn beneath the membrane releases the device for vacuum or manual pick-up.

The VR technology offers many advantages over conventional packages:

• Eliminates the need for large molded parts inventory
• Surface and edge protection
• Prevents edge chipping and chafing during shipping & handling
• Avoids accidental loss and spillage
• Eliminates die sticking in pockets and cavities
• Allows inspection of edges for damage and flaws
• Captures chip dust fragments and other particles
• Die edges are fully accessible for handling
• Multiple device size per part number 

Click here for our Gel-Pak technical datasheet on useable area and internal clearance of your device residing inside our Vacuum Release Trays.

Over the years, Gel-Pak has developed other innovative materials to add on to  their traditional purified silicone film, used in VR trays.

These include the use of silicone free gel material and also ESD safe (electro-static dissipative) gel.

For a comparison of the newer gel formulations available for sale in the market, and their corresponding tack level, you can click here to view the VR tray product series comparison chart available in our resource page.

Please contact us for more information.